MPI/Cool simulations help CAE engineers to optimize mold and cooling circuit design to achieve uniform part cooling, minimize cycle times, eliminate part warpage due to cooling factors, and improve overall cycle times.
Molding problems MoldCool Analysis can solve:
- Part Warpage Problems
- Long Cycle Times
- Part Surface appearance
- Mold setup time
Capabilities:
Optimize part and mold designs to achieve uniform cooling with the minimum cycle time.
View the temperature difference between the core and cavity mold surfaces.
Minimize unbalanced cooling and residual stress to reduce or eliminate part warpage.
Predict temperature for all surfaces within the mold: part, runners, cooling channels, inserts.
Predict the required cooling time for the part and cold runner to determine overall cycle time.
Click this icon to download our cooling brochure. (PDF 1.20mb)