MoldCool Analysis

MPI/Cool: provides tools for modeling mold cooling circuits, inserts, and bases around a part and analyzing the efficiency of the mold’s cooling design. MPI/Cool simulations help CAE engineers to optimize mold and cooling circuit design to achieve uniform part cooling, minimize cycle times, eliminate part warpage due to cooling factors, and improve overall cycle times.

Molding problems MoldCool Analysis can solve:

• Part Warpage Problems
• Long Cycle Times
• Part Surface appearance
• Mold setup time